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a
RF PLL Frequency Synthesizers ADF4110/ADF4111/ADF4112/ADF4113
GENERAL DESCRIPTION
FEATURES ADF4110: 550 MHz ADF4111: 1.2 GHz ADF4112: 3.0 GHz ADF4113: 4.0 GHz 2.7 V to 5.5 V Power Supply Separate Charge Pump Supply (VP) Allows Extended Tuning Voltage in 3 V Systems Programmable Dual Modulus Prescaler 8/9, 16/17, 32/33, 64/65 Programmable Charge Pump Currents Programmable Antibacklash Pulsewidth 3-Wire Serial Interface Analog and Digital Lock Detect Hardware and Software Power-Down Mode APPLICATIONS Base Stations for Wireless Radio (GSM, PCS, DCS, CDMA, WCDMA) Wireless Handsets (GSM, PCS, DCS, CDMA, WCDMA) Wireless LANS Communications Test Equipment CATV Equipment
The ADF4110 family of frequency synthesizers can be used to implement local oscillators in the upconversion and downconversion sections of wireless receivers and transmitters. They consist of a low-noise digital PFD (Phase Frequency Detector), a precision charge pump, a programmable reference divider, programmable A and B counters and a dual-modulus prescaler (P/P + 1). The A (6-bit) and B (13-bit) counters, in conjunction with the dual modulus prescaler (P/P + 1), implement an N divider (N = BP + A). In addition, the 14-bit reference counter (R Counter), allows selectable REFIN frequencies at the PFD input. A complete PLL (Phase-Locked Loop) can be implemented if the synthesizer is used with an external loop filter and VCO (Voltage Controlled Oscillator). Control of all the on-chip registers is via a simple 3-wire interface. The devices operate with a power supply ranging from 2.7 V to 5.5 V and can be powered down when not in use.
FUNCTIONAL BLOCK DIAGRAM
AVDD DVDD VP CPGND RSET
REFERENCE
REFIN
14-BIT R COUNTER 14 R COUNTER LATCH
PHASE FREQUENCY DETECTOR
CHARGE PUMP
CP
CLK DATA LE A, B COUNTER LATCH 19 24-BIT INPUT REGISTER 22 FUNCTION LATCH LOCK DETECT CURRENT SETTING 1 CURRENT SETTING 2
SDOUT
CPI3 CPI2 CPI1 CPI6 CPI5 CPI4
FROM FUNCTION LATCH 13 N = BP + A
HIGH Z AVDD MUX 13-BIT B COUNTER LOAD LOAD 6-BIT A COUNTER M3 M2 M1 MUXOUT
RFINA RFINB
SDOUT
PRESCALER P/P +1
6
ADF4110/ADF4111 ADF4112/ADF4113
CE
AGND
DGND
REV. A
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781/329-4700 World Wide Web Site: http://www.analog.com Fax: 781/326-8703 (c) Analog Devices, Inc., 2001
ADF4110/ADF4111/ADF4112/ADF4113-SPECIFICATIONS1T = T (AV = DV = 3 V 10%, 5 V 10%; AV V 6.0 V; AGND = DGND = CPGND = 0 V; R = 4.7 k ; dBm referred to 50 ;
DD DD DD P
SET
A
MIN to TMAX
unless
otherwise noted.)
Parameter RF CHARACTERISTICS (3 V) RF Input Frequency ADF4110 ADF4110 ADF4111 ADF4112 ADF4112 ADF4113 RF Input Sensitivity Maximum Allowable Prescaler Output Frequency3 RF CHARACTERISTICS (5 V) RF Input Frequency ADF4110 ADF4111 ADF4112 ADF4113 ADF4113 RF Input Sensitivity Maximum Allowable Prescaler Output Frequency3 REFIN CHARACTERISTICS REFIN Input Frequency Reference Input Sensitivity4 REFIN Input Capacitance REFIN Input Current PHASE DETECTOR Phase Detector Frequency5 CHARGE PUMP ICP Sink/Source High Value Low Value Absolute Accuracy RSET Range ICP 3-State Leakage Current Sink and Source Current Matching ICP vs. VCP ICP vs. Temperature LOGIC INPUTS VINH, Input High Voltage VINL, Input Low Voltage IINH/IINL, Input Current CIN, Input Capacitance LOGIC OUTPUTS VOH, Output High Voltage VOL, Output Low Voltage POWER SUPPLIES AVDD DVDD VP IDD6 (AIDD + DIDD ) ADF4110 ADF4111 ADF4112 ADF4113 IP Low Power Sleep Mode B Version B Chips2 Unit Test Conditions/Comments See Figure 3 for Input Circuit. Use a square wave for lower frequencies, below the minimum level stated. Input Level = -10 dBm Input Level = -10 dBm Input Level = -10 dBm
80/550 50/550 0.08/1.2 0.2/3.0 0.1/3.0 0.2/3.7 -15/0 165 80/550 0.08/1.4 0.1/3.0 0.2/3.7 0.2/4.0 -10/0 200 5/100 -5 10 100 55
80/550 50/550 0.08/1.2 0.2/3.0 0.1/3.0 0.2/3.7 -15/0 165 80/550 0.08/1.4 0.1/3.0 0.2/3.7 0.2/4.0 -10/0 200 5/100 -5 10 100 55
MHz min/max MHz min/max GHz min/max GHz min/max GHz min/max GHz min/max dBm min/max MHz max MHz min/max GHz min/max GHz min/max GHz min/max GHz min/max dBm min/max MHz max MHz min/max dBm min pF max A max MHz max
Use a square wave for lower frequencies, below the minimum level stated.
Input Level = -5 dBm
For f < 5 MHz, use dc-coupled square wave, (0 to VDD). AC-Coupled. When DC-Coupled: 0 to VDD max (CMOS-Compatible)
5 625 2.5 2.7/10 1 2 1.5 2 0.8 x DVDD 0.2 x DVDD 1 10 DVDD - 0.4 0.4 2.7/5.5 AVDD AVDD/6.0 5.5 5.5 7.5 11 0.5 1
5 625 2.5 2.7/10 1 2 1.5 2 0.8 x DVDD 0.2 x DVDD 1 10 DVDD - 0.4 0.4 2.7/5.5 AVDD AVDD/6.0 4.5 4.5 6.5 8.5 0.5 1 -2-
mA typ A typ % typ k typ nA typ % typ % typ % typ V min V max A max pF max V min V max V min/V max V min/V max mA max mA max mA max mA max mA max A typ
Programmable: See Table V With RSET = 4.7 k With RSET = 4.7 k See Table V 0.5 V VCP VP - 0.5 0.5 V VCP VP - 0.5 VCP = VP/2
IOH = 500 A IOL = 500 A
AVDD VP 6.0 V See TPCs 21a and 21b 4.5 mA Typical 4.5 mA Typical 6.5 mA Typical 8.5 mA Typical TA = 25C REV. A
ADF4110/ADF4111/ADF4112/ADF4113
Parameter NOISE CHARACTERISTICS ADF4113 Phase Noise Floor 7 Phase Noise Performance8 ADF4110: 540 MHz Output9 ADF4111: 900 MHz Output10 ADF4112: 900 MHz Output10 ADF4113: 900 MHz Output10 ADF4111: 836 MHz Output11 ADF4112: 1750 MHz Output 12 ADF4112: 1750 MHz Output 13 ADF4112: 1960 MHz Output 14 ADF4113: 1960 MHz Output 14 ADF4113: 3100 MHz Output 15 Spurious Signals ADF4110: 540 MHz Output9 ADF4111: 900 MHz Output10 ADF4112: 900 MHz Output10 ADF4113: 900 MHz Output10 ADF4111: 836 MHz Output11 ADF4112: 1750 MHz Output 12 ADF4112: 1750 MHz Output 13 ADF4112: 1960 MHz Output 14 ADF4113: 1960 MHz Output 14 ADF4113: 3100 MHz Output15
NOTES
Operating temperature range is as follows: B Version: -40C to +85C. The B Chip specifications are given as typical values. 3 This is the maximum operating frequency of the CMOS counters. The prescaler value should be chosen to ensure that the RF input is divided down to a frequency which is less than this value. 4 AVDD = DVDD = 3 V; For AVDD = DVDD = 5 V, use CMOS-compatible levels. 5 Guaranteed by design. 6 TA = 25C; AVDD = DVDD = 3 V; P = 16; SYNC = 0; DLY = 0; RFIN for ADF4110 = 540 MHz; RFIN for ADF4111, ADF4112, ADF4113 = 900 MHz. 7 The synthesizer phase noise floor is estimated by measuring the in-band phase noise at the output of the VCO and subtracting 20 logN (where N is the N divider value). 8 The phase noise is measured with the EVAL-ADF411XEB1 Evaluation Board and the HP8562E Spectrum Analyzer. The spectrum analyzer provides the REFIN for the synthesizer (fREFOUT = 10 MHz @ 0 dBm). SYNC = 0; DLY = 0 (See Table III). 9 fREFIN = 10 MHz; fPFD = 200 kHz; Offset frequency = 1 kHz; fRF = 540 MHz; N = 2700; Loop B/W = 20 kHz. 10 fREFIN = 10 MHz; fPFD = 200 kHz; Offset frequency = 1 kHz; fRF = 900 MHz; N = 4500; Loop B/W = 20 kHz. 11 fREFIN = 10 MHz; fPFD = 30 kHz; Offset frequency = 300 Hz; fRF = 836 MHz; N = 27867; Loop B/W = 3 kHz. 12 fREFIN = 10 MHz; fPFD = 200 kHz; Offset frequency = 1 kHz; fRF = 1750 MHz; N = 8750; Loop B/W = 20 kHz. 13 fREFIN = 10 MHz; fPFD = 10 kHz; Offset frequency = 200 Hz; fRF = 1750 MHz; N = 175000; Loop B/W = 1 kHz. 14 fREFIN = 10 MHz; fPFD = 200 kHz; Offset frequency = 1 kHz; fRF = 1960 MHz; N = 9800; Loop B/W = 20 kHz. 15 fREFIN = 10 MHz; fPFD = 1 MHz; Offset frequency = 1 kHz; fRF = 3100 MHz; N = 3100; Loop B/W = 20 kHz.
2 1
B Version -171 -164 -91 -87 -90 -91 -78 -86 -66 -84 -85 -86 -97/-106 -98/-110 -91/-100 -100/-110 -81/-84 -88/-90 -65/-73 -80/-84 -80/-84 -80/-82
B Chips2 -171 -164 -91 -87 -90 -91 -78 -86 -66 -84 -85 -86 -97/-106 -98/-110 -91/-100 -100/-110 -81/-84 -88/-90 -65/-73 -80/-84 -80/-84 -82/-82
Unit dBc/Hz typ dBc/Hz typ dBc/Hz typ dBc/Hz typ dBc/Hz typ dBc/Hz typ dBc/Hz typ dBc/Hz typ dBc/Hz typ dBc/Hz typ dBc/Hz typ dBc/Hz typ dBc typ dBc typ dBc typ dBc typ dBc typ dBc typ dBc typ dBc typ dBc typ dBc typ
Test Conditions/Comments @ 25 kHz PFD Frequency @ 200 kHz PFD Frequency @ VCO Output @ 1 kHz Offset and 200 kHz PFD Frequency @ 1 kHz Offset and 200 kHz PFD Frequency @ 1 kHz Offset and 200 kHz PFD Frequency @ 1 kHz Offset and 200 kHz PFD Frequency @ 300 Hz Offset and 30 kHz PFD Frequency @ 1 kHz Offset and 200 kHz PFD Frequency @ 200 Hz Offset and 10 kHz PFD Frequency @ 1 kHz Offset and 200 kHz PFD Frequency @ 1 kHz Offset and 200 kHz PFD Frequency @ 1 kHz Offset and 1 MHz PFD Frequency @ 200 kHz/400 kHz and 200 kHz PFD Frequency @ 200 kHz/400 kHz and 200 kHz PFD Frequency @ 200 kHz/400 kHz and 200 kHz PFD Frequency @ 200 kHz/400 kHz and 200 kHz PFD Frequency @ 30 kHz/60 kHz and 30 kHz PFD Frequency @ 200 kHz/400 kHz and 200 kHz PFD Frequency @ 10 kHz/20 kHz and 10 kHz PFD Frequency @ 200 kHz/400 kHz and 200 kHz PFD Frequency @ 200 kHz/400 kHz and 200 kHz PFD Frequency @ 1 MHz/2 MHz and 1 MHz PFD Frequency
Specifications subject to change without notice.
TIMING CHARACTERISTICS1 R
Parameter t1 t2 t3 t4 t5 t6 10 10 25 25 10 20
(AVDD = DVDD = 3 V 10%, 5 V 10%; AVDD VP 6.0 V; AGND = DGND = CPGND = 0 V; SET = 4.7 k ; TA = TMIN to TMAX unless otherwise noted.)
Unit ns min ns min ns min ns min ns min ns min Test Conditions/Comments DATA to CLOCK Setup Time DATA to CLOCK Hold Time CLOCK High Duration CLOCK Low Duration CLOCK to LE Setup Time LE Pulsewidth
Limit at TMIN to TMAX (B Version)
NOTES 1 Guaranteed by design but not production tested. Specifications subject to change without notice.
REV. A
-3-
ADF4110/ADF4111/ADF4112/ADF4113
t3
CLOCK
t4
t1
DATA DB20 (MSB) DB19
t2
DB2 DB1 (CONTROL BIT C2) DB0 (LSB) (CONTROL BIT C1)
t6
LE
t5
LE
Figure 1. Timing Diagram
ABSOLUTE MAXIMUM RATINGS 1, 2
(TA = 25C unless otherwise noted)
AVDD to GND3 . . . . . . . . . . . . . . . . . . . . . . . . -0.3 V to +7 V AVDD to DVDD . . . . . . . . . . . . . . . . . . . . . . -0.3 V to +0.3 V VP to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 V to +7 V VP to AVDD . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 V to +5.5 V Digital I/O Voltage to GND . . . . . . . . -0.3 V to VDD + 0.3 V Analog I/O Voltage to GND . . . . . . . . . -0.3 V to VP + 0.3 V REFIN, RFINA, RFINB to GND . . . . . . -0.3 V to VDD + 0.3 V RFINA to RFINB . . . . . . . . . . . . . . . . . . . . . . . . . . . 320 mV Operating Temperature Range Industrial (B Version) . . . . . . . . . . . . . . . -40C to +85C Storage Temperature Range . . . . . . . . . . . . -65C to +150C Maximum Junction Temperature . . . . . . . . . . . . . . . . 150C TSSOP JA Thermal Impedance . . . . . . . . . . . . . 150.4C/W
CSP JA Thermal Impedance (Paddle Soldered) . . . 122C/W CSP JA Thermal Impedance (Paddle Not Soldered) . . . . . . . . . . . . . . . . . . . . . 216C/W Lead Temperature, Soldering Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . 215C Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 220C
NOTES 1 Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those listed in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. 2 This device is a high-performance RF integrated circuit with an ESD rating of < 2 kV and it is ESD sensitive. Proper precautions should be taken for handling and assembly. 3 GND = AGND = DGND = 0 V.
TRANSISTOR COUNT
6425 (CMOS) and 303 (Bipolar).
CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the ADF4110/ADF4111/ADF4112/ADF4113 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
ORDERING GUIDE
Model ADF4110BRU ADF4110BCP ADF4111BRU ADF4111BCP ADF4112BRU ADF4112BCP ADF4113BRU ADF4113BCP ADF4113BCHIPS
Temperature Range -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C -40C to +85C
Package Description Thin Shrink Small Outline Package (TSSOP) Chip Scale Package (CSP) Thin Shrink Small Outline Package (TSSOP) Chip Scale Package (CSP) Thin Shrink Small Outline Package (TSSOP) Chip Scale Package (CSP) Thin Shrink Small Outline Package (TSSOP) Chip Scale Package (CSP) DICE
Package Option* RU-16 CP-20 RU-16 CP-20 RU-16 CP-20 RU-16 CP-20 DICE
*Contact the factory for chip availability.
-4-
REV. A
ADF4110/ADF4111/ADF4112/ADF4113
PIN FUNCTION DESCRIPTIONS
Pin No. 1
Mnemonic RSET
Function Connecting a resistor between this pin and CPGND sets the maximum charge pump output current. The nominal voltage potential at the RSET pin is 0.56 V. The relationship between ICP and RSET is
ICP max =
23.5 RSET
2 3 4 5 6 7 8
CP CPGND AGND RFINB RFINA AVDD REFIN
9 10 11 12 13 14 15 16
DGND CE CLK DATA LE MUXOUT DVDD VP
So, with RSET = 4.7 k, ICPmax = 5 mA. Charge Pump Output. When enabled this provides ICP to the external loop filter, which in turn drives the external VCO. Charge Pump Ground. This is the ground return path for the charge pump. Analog Ground. This is the ground return path of the prescaler. Complementary Input to the RF Prescaler. This point should be decoupled to the ground plane with a small bypass capacitor, typically 100 pF. See Figure 3. Input to the RF Prescaler. This small signal input is ac-coupled from the VCO. Analog Power Supply. This may range from 2.7 V to 5.5 V. Decoupling capacitors to the analog ground plane should be placed as close as possible to this pin. AVDD must be the same value as DVDD. Reference Input. This is a CMOS input with a nominal threshold of VDD/2 and an equivalent input resistance of 100 k. See Figure 2. This input can be driven from a TTL or CMOS crystal oscillator or it can be ac-coupled. Digital Ground. Chip Enable. A logic low on this pin powers down the device and puts the charge pump output into threestate mode. Taking the pin high will power up the device depending on the status of the power-down bit F2. Serial Clock Input. This serial clock is used to clock in the serial data to the registers. The data is latched into the 24-bit shift register on the CLK rising edge. This input is a high impedance CMOS input. Serial Data Input. The serial data is loaded MSB first with the two LSBs being the control bits. This input is a high impedance CMOS input. Load Enable, CMOS Input. When LE goes high, the data stored in the shift registers is loaded into one of the four latches, the latch being selected using the control bits. This multiplexer output allows either the Lock Detect, the scaled RF or the scaled Reference Frequency to be accessed externally. Digital Power Supply. This may range from 2.7 V to 5.5 V. Decoupling capacitors to the digital ground plane should be placed as close as possible to this pin. DVDD must be the same value as AVDD. Charge Pump Power Supply. This should be greater than or equal to VDD. In systems where VDD is 3 V, it can be set to 6 V and used to drive a VCO with a tuning range of up to 6 V.
PIN CONFIGURATIONS TSSOP
RSET 1 CP 2 CPGND 3 AGND 4 RFINB 5
16 VP
CHIP SCALE PACKAGE
17 DVDD DGND 9 19 RSET 16 DVDD
15 MUXOUT 14 LE 13 DATA 12 CLK 11 CE
20 CP
ADF4110 ADF4111 ADF4112 ADF4113
15 DVDD 14 MUXOUT 13 LE
CPGND AGND AGND RFINB RFINA
1 2 3 4 5
TOP VIEW 12 DATA (Not to Scale) 11 CLK RFINA 6 AVDD 7 REFIN 8
10 CE 9
ADF4110 ADF4111 ADF4112 ADF4113
TOP VIEW (Not to Scale)
REV. A
-5-
DGND 10
AVDD 6
AVDD 7
REFIN 8
DGND
18 VP
ADF4110/ADF4111/ADF4112/ADF4113
0
FREQ-UNIT PARAM-TYPE DATA-FORMAT KEYWORD GHz S MA R FREQ 0.05 0.10 0.15 0.20 0.25 0.30 0.35 0.40 0.45 0.50 0.55 0.60 0.65 0.70 0.75 0.80 0.85 0.90 0.95 1.00 MAGS11 0.89207 0.8886 0.89022 0.96323 0.90566 0.90307 0.89318 0.89806 0.89565 0.88538 0.89699 0.89927 0.87797 0.90765 0.88526 0.81267 0.90357 0.92954 0.92087 0.93788 ANGS11 -2.0571 -4.4427 -6.3212 -2.1393 -12.13 -13.52 -15.746 -18.056 -19.693 -22.246 -24.336 -25.948 -28.457 -29.735 -31.879 -32.681 -31.522 -34.222 -36.961 -39.343 FREQ 1.05 1.10 1.15 1.20 1.25 1.30 1.35 1.40 1.45 1.50 1.55 1.60 1.65 1.70 1.75 1.80 IMPEDANCE - OHMS 50 ANGS11 -40.134 -43.747 -44.393 -46.937 -49.6 -51.884 -51.21 -53.55 -56.786 -58.781 -60.545 -61.43 -61.241 -64.051 -66.19 -63.775
-10 -20
REFERENCE LEVEL = -4.2dBm
MAGS11 0.9512 0.93458 0.94782 0.96875 0.92216 0.93755 0.96178 0.94354 0.95189 0.97647 0.98619 0.95459 0.97945 0.98864 0.97399 0.97216
OUTPUT POWER - dB
-30 -40 -50 -60 -70 -80 -90
VDD = 3V, VP = 5V ICP = 5mA PFD FREQUENCY = 200kHz LOOP BANDWIDTH = 20kHz RES. BANDWIDTH = 10Hz VIDEO BANDWIDTH = 10Hz SWEEP = 1.9 SECONDS AVERAGES = 19
-92.5dBc/Hz
-100
-2kHz
-1kHz
900MHz
+1kHz
+2kHz
TPC 1. S-Parameter Data for the ADF4113 RF Input (Up to 1.8 GHz)
TPC 4. ADF4113 Phase Noise (900 MHz, 200 kHz, 20 kHz) with DLY and SYNC Enabled
0 -5
RF INPUT POWER - dBm
10dB/DIVISION -40
RL = -40dBc/Hz
RMS NOISE = 0.52
VDD = 3V VP = 3V
PHASE NOISE - dBc/Hz
-50 -60 0.52 rms -70 -80 -90 -100 -110 -120
-10 -15 TA = +85 C TA = +25 C -25 -30
-20
-130
TA = -40 C -35 0 1 3 2 RF INPUT FREQUENCY - GHz 4 5
-140 100Hz FREQUENCY OFFSET FROM 900MHz CARRIER 1MHz
TPC 2. Input Sensitivity (ADF4113)
TPC 5. ADF4113 Integrated Phase Noise (900 MHz, 200 kHz, 20 kHz, Typical Lock Time: 400 s)
0 -10 -20
OUTPUT POWER - dB
10dB/DIVISION -40
RL = -40dBc/Hz
RMS NOISE = 0.62
REFERENCE LEVEL = -4.2dBm
-30 -40 -50 -60 -70 -80 -90 -100 -2kHz -1kHz
PHASE NOISE - dBc/Hz
VDD = 3V, VP = 5V ICP = 5mA PFD FREQUENCY = 200kHz LOOP BANDWIDTH = 20kHz RES. BANDWIDTH = 10Hz VIDEO BANDWIDTH = 10Hz SWEEP = 1.9 SECONDS AVERAGES = 19
-50 -60 0.62 rms -70 -80 -90 -100 -110 -120 -130
-91.0dBc/Hz
900MHz
+1kHz
+2kHz
-140 100Hz
FREQUENCY OFFSET FROM 900MHz CARRIER
1MHz
TPC 3. ADF4113 Phase Noise (900 MHz, 200 kHz, 20 kHz)
TPC 6. ADF4113 Integrated Phase Noise (900 MHz, 200 kHz, 35 kHz, Typical Lock Time: 200 s)
-6-
REV. A
ADF4110/ADF4111/ADF4112/ADF4113
0 -10 -20
OUTPUT POWER - dB
10dB/DIVISION -40
RL = -40dBc/Hz
RMS NOISE = 1.6
REFERENCE LEVEL = -4.2dBm
PHASE NOISE - dBc/Hz
-30 -40 -50 -60 -70 -80 -90
VDD = 3V, VP = 5V ICP = 5mA PFD FREQUENCY = 200kHz LOOP BANDWIDTH = 20kHz RES. BANDWIDTH = 1kHz VIDEO BANDWIDTH = 1kHz SWEEP = 2.5 SECONDS AVERAGES = 30
-50 -60 -70 1.6 rms -80 -90 -100 -110 -120 -130 -140 100Hz
-90.2dBc
-100 -400kHz -200kHz 900MHz +200kHz +400kHz
FREQUENCY OFFSET FROM 1750MHz CARRIER
1MHz
TPC 7. ADF4113 Reference Spurs (900 MHz, 200 kHz, 20 kHz)
TPC 10. ADF4113 Integrated Phase Noise (1750 MHz, 30 kHz, 3 kHz)
0 -10 -20
OUTPUT POWER - dB
0
REFERENCE LEVEL = -4.2dBm
POWER OUTPUT - dB
-30 -40 -50 -60 -70 -80 -90
VDD = 3V, VP = 5V ICP = 5mA PFD FREQUENCY = 200kHz LOOP BANDWIDTH = 35kHz RES. BANDWIDTH = 1kHz VIDEO BANDWIDTH = 1kHz SWEEP = 2.5 SECONDS AVERAGES = 30
-10 -20 -30 -40 -50 -60 -70 -80 -90 -100
REFERENCE LEVEL = -5.7dBm
VDD = 3V, VP = 5V ICP = 5mA PFD FREQUENCY = 30kHz LOOP BANDWIDTH = 3kHz RES. BANDWIDTH = 3Hz VIDEO BANDWIDTH = 3Hz SWEEP = 255 SECONDS POSITIVE PEAK DETECT MODE
-79.6dBc
-89.3dBc
-100
-400kHz
-200kHz
900MHz
+200kHz
+400kHz
-80kHz
-40kHz
1750MHz
+40kHz
+80kHz
TPC 8. ADF4113 Reference Spurs (900 MHz, 200 kHz, 35 kHz)
TPC 11. ADF4113 Reference Spurs (1750 MHz, 30 kHz, 3 kHz)
0 -10 -20
OUTPUT POWER - dB
REFERENCE LEVEL = -8.0dBm
0
OUTPUT POWER - dB
-30 -40 -50 -60 -70 -80 -90
VDD = 3V, VP = 5V ICP = 5mA PFD FREQUENCY = 30kHz LOOP BANDWIDTH = 3kHz RES. BANDWIDTH = 10kHz VIDEO BANDWIDTH = 10kHz SWEEP = 477ms AVERAGES = 10
-10 -20 -30 -40 -50 -60
REFERENCE LEVEL = -4.2dBm
VDD = 3V, VP = 5V ICP = 5mA PFD FREQUENCY = 1MHz LOOP BANDWIDTH = 100kHz RES. BANDWIDTH = 10Hz VIDEO BANDWIDTH = 10Hz SWEEP = 1.9 SECONDS AVERAGES = 45
-86.6dBc/Hz -70 -80 -90
-75.2dBc/Hz
-100 -400Hz -200Hz 1750MHz +200Hz +400Hz
-100
-2kHz
-1kHz
3100MHz
+1kHz
+2kHz
TPC 9. ADF4113 Phase Noise (1750 MHz, 30 kHz, 3 kHz)
TPC 12. ADF4113 Phase Noise (3100 MHz, 1 MHz, 100 kHz)
REV. A
-7-
ADF4110/ADF4111/ADF4112/ADF4113
10dB/DIVISION -40 -50 -60 1.7 rms RL = -40dBc/Hz RMS NOISE = 1.7
-60 VDD = 3V VP = 3V
PHASE NOISE - dBc/Hz
-70 -80 -90 -100 -110 -120 -130 -140 100Hz
PHASE NOISE - dBc/Hz
-70
-80
-90
-100 -40
FREQUENCY OFFSET FROM 3100MHz CARRIER 1MHz
-20
0
20 40 TEMPERATURE - C
60
80
100
TPC 13. ADF4113 Integrated Phase Noise (3100 MHz, 1 MHz, 100 kHz)
0 -10 -20
OUTPUT POWER - dB
TPC 16. ADF4113 Phase Noise vs. Temperature (900 MHz, 200 kHz, 20 kHz)
-60
REFERENCE LEVEL = -17.2dBm
FIRST REFERENCE SPUR - dBc
-30 -40 -50 -60 -70 -80 -90 -100 -2MHz -1MHz
VDD = 3V, VP = 5V ICP = 5mA PFD FREQUENCY = 1MHz LOOP BANDWIDTH = 100kHz RES. BANDWIDTH = 1kHz VIDEO BANDWIDTH = 1kHz SWEEP = 13 SECONDS AVERAGES = 1
VDD = 3V VP = 5V -70
-80
-80.6dBc
-90
3100MHz
+1MHz
+2MHz
-100 -40
-20
0
20 40 TEMPERATURE - C
60
80
100
TPC 14. ADF4113 Reference Spurs (3100 MHz, 1 MHz, 100 kHz)
TPC 17. ADF4113 Reference Spurs vs. Temperature (900 MHz, 200 kHz, 20 kHz)
-120 VDD = 3V VP = 5V -130
-5 -15 VDD = 3V VP = 5V
FIRST REFERENCE SPUR - dBc
1 10 100 1000 PHASE DETECTOR FREQUENCY - kHz 10000
-25 -35 -45 -55 -65 -75 -85 -95
PHASE NOISE - dBc/Hz
-140
-150
-160
-170
-180
-105
0
1
2 3 TUNING VOLTAGE - Volts
4
5
TPC 15. ADF4113 Phase Noise (Referred to CP Output) vs. PFD Frequency
TPC 18. ADF4113 Reference Spurs (200 kHz) vs. VTUNE (900 MHz, 200 kHz, 20 kHz)
-8-
REV. A
ADF4110/ADF4111/ADF4112/ADF4113
-60 VDD = 3V VP = 5V
10 9 8 7
AIDD - mA
ADF4113
PHASE NOISE - dBc/Hz
-70
6 5 4 3
-80
ADF4112
-90
2 1
-100 -40 -20 0 20 40 TEMPERATURE - C 60 80 100
ADF4110 ADF4111
0 8/9 16/17 PRESCALER VALUE 32/33 64/65
0
TPC 19. ADF4113 Phase Noise vs. Temperature (836 MHz, 30 kHz, 3 kHz)
TPC 21a. AIDD vs. Prescaler Value
-60 VDD = 3V VP = 5V -70
3.0
VDD = 3V VP = 3V
FIRST REFERENCE SPUR - dBc
2.5
2.0
DIDD - mA
-20 0 20 40 TEMPERATURE - C 60 80 100
-80
1.5
1.0
-90
0.5
-100 -40
0
0
50 100 150 PRESCALER OUTPUT FREQUENCY - MHz
200
TPC 20. ADF4113 Reference Spurs vs. Temperature (836 MHz, 30 kHz, 3 kHz)
TPC 21b. DIDD vs. Prescaler Output Frequency (ADF4110, ADF4111, ADF4112, ADF4113)
6 5 4 3 2 lCP - mA 1 0 -1 -2 -3 -4 -5 -6 0 0.5 1 1.5 2 2.5 3 VCP - Volts 3.5 4 4.5 5 VPP = 5V ICP SETTING : 5mA
TPC 22. Charge Pump Output Characteristics for ADF4110 Family
REV. A
-9-
ADF4110/ADF4111/ADF4112/ADF4113
CIRCUIT DESCRIPTION
REFERENCE INPUT SECTION Pulse Swallow Function
The reference input stage is shown in Figure 2. SW1 and SW2 are normally-closed switches. SW3 is normally-open. When power-down is initiated, SW3 is closed and SW1 and SW2 are opened. This ensures that there is no loading of the REFIN pin on power-down.
POWER-DOWN CONTROL 100k TO R COUNTER BUFFER SW3 NO
The A and B counters, in conjunction with the dual modulus prescaler, make it possible to generate output frequencies that are spaced only by the Reference Frequency divided by R. The equation for the VCO frequency is as follows: fVCO = [(P x B) + A] x fREFIN/R fVCO P B A Output frequency of external voltage controlled oscillator (VCO). Preset modulus of dual modulus prescaler Preset Divide Ratio of binary 13-bit counter (3 to 8191). Preset Divide Ratio of binary 6-bit swallow counter (0 to 63).
NC REFIN NC SW1
SW2
fREFIN Output frequency of the external reference frequency oscillator. R Preset divide ratio of binary 14-bit programmable reference counter (1 to 16383).
Figure 2. Reference Input Stage
RF INPUT STAGE
The RF input stage is shown in Figure 3. It is followed by a 2-stage limiting amplifier to generate the CML (Current Mode Logic) clock levels needed for the prescaler.
BIAS GENERATOR 500 RFINA RFINB 1.6V AVDD 500
R COUNTER
The 14-bit R counter allows the input reference frequency to be divided down to produce the reference clock to the phase frequency detector (PFD). Division ratios from 1 to 16,383 are allowed.
N = BP + A 13-BIT B COUNTER FROM RF INPUT STAGE PRESCALER P/P + 1 MODULUS CONTROL
AGND
TO PFD
LOAD LOAD 6-BIT A COUNTER
Figure 3. RF Input Stage Figure 4. A and B Counters
PRESCALER (P/P+1)
The dual-modulus prescaler (P/P+1), along with the A and B counters, enables the large division ratio, N, to be realized (N = BP + A). The dual-modulus prescaler, operating at CML levels, takes the clock from the RF input stage and divides it down to a manageable frequency for the CMOS A and B counters. The prescaler is programmable. It can be set in software to 8/9, 16/17, 32/33, or 64/65. It is based on a synchronous 4/5 core.
A AND B COUNTERS
PHASE FREQUENCY DETECTOR (PFD) AND CHARGE PUMP
The A and B CMOS counters combine with the dual modulus prescaler to allow a wide ranging division ratio in the PLL feedback counter. The counters are specified to work when the prescaler output is 200 MHz or less. Thus, with an RF input frequency of 2.5 GHz, a prescaler value of 16/17 is valid but a value of 8/9 is not valid.
The PFD takes inputs from the R counter and N counter (N = BP + A) and produces an output proportional to the phase and frequency difference between them. Figure 5 is a simplified schematic. The PFD includes a programmable delay element which controls the width of the antibacklash pulse. This pulse ensures that there is no dead zone in the PFD transfer function and minimizes phase noise and reference spurs. Two bits in the Reference Counter Latch, ABP2 and ABP1 control the width of the pulse. See Table III.
-10-
REV. A
ADF4110/ADF4111/ADF4112/ADF4113
VP CHARGE PUMP HI D1 U1 R DIVIDER CLR1 Q1 UP
The N-channel open-drain analog lock detect should be operated with an external pull-up resistor of 10 k nominal. When lock has been detected this output will be high with narrow lowgoing pulses.
DVDD
PROGRAMMABLE DELAY
U3
CP
ABP1 CLR2 HI D2 U2 N DIVIDER Q2
ABP2
ANALOG LOCK DETECT DIGITAL LOCK DETECT R COUNTER OUTPUT N COUNTER OUTPUT SDOUT
MUX
CONTROL
MUXOUT
DOWN
DGND
Figure 6. MUXOUT Circuit
CPGND
INPUT SHIFT REGISTER
R DIVIDER
N DIVIDER
CP OUTPUT
Figure 5. PFD Simplified Schematic and Timing (In Lock)
MUXOUT AND LOCK DETECT
The ADF4110 family digital section includes a 24-bit input shift register, a 14-bit R counter and a 19-bit N counter, comprising a 6-bit A counter and a 13-bit B counter. Data is clocked into the 24-bit shift register on each rising edge of CLK. The data is clocked in MSB first. Data is transferred from the shift register to one of four latches on the rising edge of LE. The destination latch is determined by the state of the two control bits (C2, C1) in the shift register. These are the two LSBs DB1, DB0 as shown in the timing diagram of Figure 1. The truth table for these bits is shown in Table VI. Table I shows a summary of how the latches are programmed.
Table I. C2, C1 Truth Table
The output multiplexer on the ADF4110 family allows the user to access various internal points on the chip. The state of MUXOUT is controlled by M3, M2 and M1 in the function latch. Table V shows the full truth table. Figure 6 shows the MUXOUT section in block diagram form.
Lock Detect
Control Bits C2 C1 0 0 1 1 0 1 0 1
Data Latch R Counter N Counter (A and B) Function Latch (Including Prescaler) Initialization Latch
MUXOUT can be programmed for two types of lock detect: digital lock detect and analog lock detect. Digital lock detect is active high. When LDP in the R counter latch is set to 0, digital lock detect is set high when the phase error on three consecutive Phase Detector cycles is less than 15 ns. With LDP set to 1, five consecutive cycles of less than 15 ns are required to set the lock detect. It will stay set high until a phase error of greater than 25 ns is detected on any subsequent PD cycle.
REV. A
-11-
ADF4110/ADF4111/ADF4112/ADF4113
Table II. ADF4110 Family Latch Summary
REFERENCE COUNTER LATCH
RESERVED LOCK DETECT PRECISION
DLY
SYNC
TEST MODE BITS
ANTIBACKLASH WIDTH DB16 DB15 R14 DB14 DB13 R13 R12
14-BIT REFERENCE COUNTER, R DB12 DB11 R11 R10 DB10 R9 DB9 R8 DB8 R7 DB7 R6 DB6 R5 DB5 R4 DB4 R3 DB3 R2 DB2 R1
CONTROL BITS DB1 DB0
DB23
DB22 DB21 DLY SYNC
DB20 DB19 LDP T2
DB18 DB17 T1
X
ABP2 ABP1
C2 (0) C1 (0)
X = DON'T CARE
N COUNTER LATCH
CP GAIN
RESERVED DB23 DB22
13-BIT B COUNTER DB19 B12 DB18 DB17 DB16 DB15 B11 B10 B9 B8 DB14 DB13 B7 B6 DB12 DB11 B5 B4 DB10 B3 DB9 B2 DB8 B1 DB7 A6 DB6 A5
6-BIT A COUNTER DB5 A4 DB4 A3 DB3 A2 DB2 A1
CONTROL BITS DB1 DB0
DB21 DB20 G1 B13
X
X
C2 (0) C1 (1)
X = DON'T CARE
FUNCTION LATCH
FASTLOCK MODE FASTLOCK ENABLE PD POLARITY COUNTER RESET
DB2 F1
POWERDOWN 2
PRESCALER VALUE DB23 P2
CURRENT SETTING 2 DB20 DB19 CPI6 CPI5
CURRENT SETTING 1
TIMER COUNTER CONTROL
POWERDOWN 1
CP THREESTATE
MUXOUT CONTROL DB6 M3 DB5 M2 DB4 M1
CONTROL BITS DB1 DB0
DB22 DB21 P1 PD2
DB18 DB17 CPI4 CPI3
DB16 DB15 DB14 DB13 DB12 DB11 CPI2 CPI1 TC4 TC3 TC2 TC1
DB10 F5
DB9 F4
DB8 F3
DB7 F2
DB3 PD1
C2 (1) C1 (0)
INITIALIZATION LATCH
FASTLOCK MODE FASTLOCK ENABLE PD POLARITY COUNTER RESET
DB2 F1
POWERDOWN 2
PRESCALER VALUE DB23 DB22 P2 P1
CURRENT SETTING 2 DB19 DB18 CPI5 CPI4
CURRENT SETTING 1 DB17 DB16 CPI3 CPI2
TIMER COUNTER CONTROL DB13 DB12 TC3 TC2
MUXOUT CONTROL DB6 M3 DB5 M2 DB4 M1
POWERDOWN 1
CP THREESTATE
CONTROL BITS DB1 DB0
DB21 DB20 PD2 CPI6
DB15 DB14 CPI1 TC4
DB11 DB10 TC1 F5
DB9 F4
DB8 F3
DB7 F2
DB3 PD1
C2 (1) C1 (1)
-12-
REV. A
ADF4110/ADF4111/ADF4112/ADF4113
Table III. Reference Counter Latch Map
RESERVED
LOCK DETECT PRECISION
DLY
SYNC
TEST MODE BITS DB19 DB18 T2 T1
ANTIBACKLASH WIDTH DB17 DB16 ABP2 ABP1 DB15 DB14 R14 R13 DB13 DB12 R12 R11
14-BIT REFERENCE COUNTER DB11 DB10 R10 R9 DB9 R8 DB8 R7 DB7 R6 DB6 R5 DB5 R4 DB4 R3 DB3 R2 DB2 R1
CONTROL BITS DB1 DB0
DB23 DB22
DB21 DB20 SYNC LDP
X
DLY
C2 (0) C1 (0)
X = DON'T CARE R14 0 0 0 0 * * * 1 1 1 1 R13 0 0 0 0 * * * 1 1 1 1 R12 0 0 0 0 * * * 1 1 1 1 ********** ********** ********** ********** ********** ********** ********** ********** ********** ********** ********** ********** R3 0 0 0 1 * * * 1 1 1 1 R2 0 1 1 0 * * * 0 0 1 1 R1 1 0 1 0 * * * 0 1 0 1 DIVIDE RATIO 1 2 3 4 * * * 16380 16381 16382 16383
ABP2 ABP1 0 0 1 1 0 1 0 1
ANTIBACKLASH PULSEWIDTH 3.0ns 1.5ns 6.0ns 3.0ns
TEST MODE BITS SHOULD BE SET TO 00 FOR NORMAL OPERATION
LDP 0
OPERATION THREE CONSECUTIVE CYCLES OF PHASE DELAY LESS THAN 15ns MUST OCCUR BEFORE LOCK DETECT IS SET. FIVE CONSECUTIVE CYCLES OF PHASE DELAY LESS THAN 15ns MUST OCCUR BEFORE LOCK DETECT IS SET.
1
DLY 0 0
SYNC 0 1
OPERATION NORMAL OPERATION OUTPUT OF PRESCALER IS RESYNCHRONIZED WITH NONDELAYED VERSION OF RF INPUT NORMAL OPERATION OUTPUT OF PRESCALER IS RESYNCHRONIZED WITH DELAYED VERSION OF RF INPUT
1 1
0 1
REV. A
-13-
ADF4110/ADF4111/ADF4112/ADF4113
Table IV. AB Counter Latch Map
CP GAIN
RESERVED DB23 DB22
13-BIT B COUNTER DB19 DB18 B12 B11 DB17 DB16 B10 B9 DB15 DB14 B8 B7 DB13 DB12 B6 B5 DB11 DB10 B4 B3 DB9 B2 DB8 B1 DB7 A6
6-BIT A COUNTER DB6 A5 DB5 A4 DB4 A3 DB3 A2 DB2 A1
CONTROL BITS DB1 DB0
DB21 DB20 G1 B13
X
X
C2 (0) C1 (1)
X = DON'T CARE A6 0 0 0 0 * * * 1 1 1 1 A5 0 0 0 0 * * * 1 1 1 1 A2 0 0 1 1 * * * 0 0 1 1 A1 0 1 0 1 * * * 0 1 0 1 A COUNTER DIVIDE RATIO 0 1 2 3 * * * 60 61 62 63
********** ********** ********** ********** ********** ********** ********** ********** ********** ********** ********** **********
B13 0 0 0 0 0 * * * 1 1 1 1
B12 0 0 0 0 0 * * * 1 1 1 1
B11 0 0 0 0 0 * * * 1 1 1 1
********** ********** ********** ********** ********** ********** ********** ********** ********** ********** ********** ********** **********
B3 0 0 0 0 1 * * * 1 1 1 1
B2 0 0 1 1 0 * * * 0 0 1 1
B1 0 1 0 1 0 * * * 0 1 0 1
B COUNTER DIVIDE RATIO NOT ALLOWED NOT ALLOWED NOT ALLOWED 3 4 * * * 8188 8189 8190 8191
F4 (FUNCTION LATCH) FASTLOCK ENABLE* 0 0 1 1
CP GAIN 0 1 0 1
OPERATION CHARGE PUMP CURRENT SETTTING 1 IS PERMANENTLY USED CHARGE PUMP CURRENT SETTING 2 IS PERMANENTLY USED CHARGE PUMP CURRENT SETTING 1 IS USED CHARGE PUMP CURRENT IS SWITCHED TO SETTING 2. THE TIME SPENT IN SETTING 2 IS DEPENDENT UPON WHICH FASTLOCK MODE IS USED. SEE FUNCTION LATCH DESCRIPTION
*SEE TABLE 5
N = BP + A, P IS PRESCALER VALUE SET IN THE FUNCTION LATCH B MUST BE GREATER THAN OR EQUAL TO A. FOR CONTINUOUSLY ADJACENT VALUES OF (NX FREF), AT THE OUTPUT, NMIN IS (P2-P).
THESE BITS ARE NOT USED BY THE DEVICE AND ARE DON'T CARE BITS
-14-
REV. A
ADF4110/ADF4111/ADF4112/ADF4113
Table V. Function Latch Map
CP THREE-STATE
FASTLOCK MODE
FASTLOCK ENABLE
PD POLARITY
PRESCALER VALUE
CURRENT SETTTING 2
CURRENT SETTTING 1
TIMER COUNTER CONTROL
MUXOUT CONTROL
COUNTER RESET
DB2 F1
POWERDOWN 2
POWERDOWN 1
CONTROL BITS
DB23 DB22 P2 P1
DB21 DB20 PD2 CPI6
DB19 DB18 CPI5 CPI4
DB17 DB16 CPI3 CPI2
DB15 DB14 CPI1 TC4
DB13 DB12 TC3 TC2
DB11 DB10 TC1 F5
DB9 F4
DB8 F3
DB7 F2
DB6 M3
DB5 M2
DB4 M1
DB3 PD1
DB1 C2(1)
DB0 C1(0)
F1 F2 0 1 F3 0 1 F4 0 1 1 F5 X 0 1
COUNTER OPERATION
NORMAL R, A, B COUNTERS HELD IN RESET
PHASE DETECTOR POLARITY
NEGATIVE POSITIVE
0 1
CHARGE PUMP OUTPUT
NORMAL THREE-STATE
FASTLOCK MODE
FASTLOCK DISABLED FASTLOCK MODE 1 FASTLOCK MODE2
TC4
0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1
TC3
0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1
TC2
0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1
TC1
0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1
TIMEOUT (PFD CYCLES)
3 7 11 15 19 23 27 31 35 39 43 47 51 55 59 63 1 1 1 1 0 0 1 1 0 1 0 1 R DIVIDER OUTPUT ANALOG LOCK DETECT (N-CHANNEL OPEN-DRAIN) SERIAL DATA OUTPUT DGND 0 0 1 1 0 1
M3
0 0
M2
0 0
M1
0 1
OUTPUT
THREE-STATE OUTPUT DIGITAL LOCK DETECT (ACTIVE HIGH) N DIVIDER OUTPUT DVDD
SEE PAGE 17
CPI6 CPI3
0 0 0 0 1 1 1 1
CPI5 CPI2
0 0 1 1 0 0 1 1
CPI4 CPI1
0 1 0 1 0 1 0 1
ICP (mA) 2.7k
1.09 2.18 3.26 4.35 5.44 6.53 7.62 8.70
4.7k
0.63 1.25 1.88 2.50 3.13 3.75 4.38 5.00
10k
0.29 0.59 0.88 1.76 1.47 1.76 2.06 2.35
CE PIN PD2 PD1
0 1 1 1 P2 0 0 1 1 P1 0 1 0 1 X X 0 1 X 0 1 1
MODE
ASYNCHRONOUS POWER-DOWN NORMAL OPERATION ASYNCHRONOUS POWER-DOWN SYNCHRONOUS POWER-DOWN
PRESCALER VALUE
8/9 16/17 32/33 64/65
REV. A
-15-
ADF4110/ADF4111/ADF4112/ADF4113
Table VI. Initialization Latch Map
CP THREE-STATE
FASTLOCK ENABLE
PD POLARITY
FASTLOCK MODE
PRESCALER VALUE
CURRENT SETTTING 2
CURRENT SETTTING 1
TIMER COUNTER CONTROL
DB13 DB12
COUNTER RESET
DB2
F1
POWERDOWN 2
POWERDOWN 1
MUXOUT CONTROL
CONTROL BITS
DB23 DB22 DB21
DB20 CPI6
DB19 DB18 CPI5 CPI4
DB17 DB16 CPI3 CPI2
DB15 DB14 CPI1
TC4
DB11 DB10
DB9
F4
DB8
F3
DB7
F2
DB6 M3
DB5 M2
DB4 M1
DB3 PD1
DB1
DB0
P2
P1
PD2
TC3
TC2
TC1
F5
C2 (1) C1 (1)
F1 F2 0 1 F3 0 1 F4 0 1 1 F5 X 0 1 PHASE DETECTOR POLARITY NEGATIVE POSITIVE 0 1
COUNTER OPERATION NORMAL R, A, B COUNTERS HELD IN RESET
CHARGE PUMP
OUTPUT NORMAL THREE-STATE
FASTLOCK MODE
FASTLOCK DISABLED FASTLOCK MODE 1 FASTLOCK MODE2 TIMEOUT (PFD CYCLES) 3 7 11 15 19 23 27 31 35 39 43 47 51 55 59 63 0 1 1 1 1 1 0 0 1 1 1 0 1 0 1 DVDD R DIVIDER OUTPUT ANALOG LOCK DETECT (N-CHANNEL OPEN-DRAIN) SERIAL DATA OUTPUT DGND 0 0 0 1 1 0 DIGITAL LOCK DETECT (ACTIVE HIGH) N DIVIDER OUTPUT
TC4
0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 CPI6 CPI3 0 0 0 0 1 1 1 1 CPI5 CPI2 0 0 1 1 0 0 1 1 CPI4 CPI1 0 1 0 1 0 1 0 1
MODE
TC3
0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1
TC2
0 0 1 1 0 0 1 1 0 0 1 1 0 0 1 1
TC1
0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1
M3
0
M2
0
M1
0
OUTPUT
THREE-STATE OUTPUT
SEE PAGE 17 ICP (mA)
2.7k
1.09 2.18 3.27 4.35 5.44 6.53 7.62 8.70
4.7k
0.63 1.25 1.88 2.50 3.13 3.75 4.38 5.00
10k
0.29 0.59 0.88 1.76 1.47 1.76 2.06 2.35
CE PIN
0 1 1 1 P2 0 0 1 1 P1 0 1 0 1
PD2 PD1
X X 0 1 X 0 1 1
ASYNCHRONOUS POWER-DOWN NORMAL OPERATION ASYNCHRONOUS POWER-DOWN SYNCHRONOUS POWER-DOWN
PRESCALER VALUE 8/9 16/17 32/33 64/65
-16-
REV. A
ADF4110/ADF4111/ADF4112/ADF4113
THE FUNCTION LATCH Fastlock Mode 2
With C2, C1 set to 1, 0, the on-chip function latch will be programmed. Table V shows the input data format for programming the Function Latch.
Counter Reset
The charge pump current is switched to the contents of Current Setting 2. The device enters Fastlock by having a "1" written to the CP Gain bit in the AB counter latch. The device exits Fastlock under the control of the Timer Counter. After the timeout period determined by the value in TC4-TC1, the CP Gain bit in the AB counter latch is automatically reset to "0" and the device reverts to normal mode instead of Fastlock. See Table V for the timeout periods.
Timer Counter Control
DB2 (F1) is the counter reset bit. When this is "1," the R counter and the A, B counters are reset. For normal operation this bit should be "0." Upon powering up, the F1 bit needs to be disabled, the N counter resumes counting in "close" alignment with the R counter. (The maximum error is one prescaler cycle.)
Power-Down
DB3 (PD1) and DB21 (PD2) on the ADF4110 family, provide programmable power-down modes. They are enabled by the CE pin. When the CE pin is low, the device is immediately disabled regardless of the states of PD2, PD1. In the programmed asynchronous power-down, the device powers down immediately after latching a "1" into bit PD1, with the condition that PD2 has been loaded with a "0." In the programmed synchronous power-down, the device powerdown is gated by the charge pump to prevent unwanted frequency jumps. Once the power-down is enabled by writing a "1" into bit PD1 (on condition that a "1" has also been loaded to PD2), the device will go into power-down on the occurrence of the next charge pump event. When a power-down is activated (either synchronous or asynchronous mode including CE-pin-activated power-down), the following events occur: All active dc current paths are removed. The R, N, and timeout counters are forced to their load state conditions. The charge pump is forced into three-state mode. The digital clock detect circuitry is reset. The RFIN input is debiased. The reference input buffer circuitry is disabled. The input register remains active and capable of loading and latching data.
MUXOUT Control
The user has the option of programming two charge pump currents. The intent is that the Current Setting 1 is used when the RF output is stable and the system is in a static state. Current Setting 2 is meant to be used when the system is dynamic and in a state of change (i.e., when a new output frequency is programmed). The normal sequence of events is as follows: The user initially decides what the preferred charge pump currents are going to be. For example, they may choose 2.5 mA as Current Setting 1 and 5 mA as the Current Setting 2. At the same time, they must also decide how long they want the secondary current to stay active before reverting to the primary current. This is controlled by the Timer Counter Control Bits DB14 to DB11 (TC4-TC1) in the Function Latch. The truth table is given in Table V. When the user wishes to program a new output frequency, he can simply program the AB counter latch with new values for A and B. At the same time, he can set the CP Gain bit to a "1," which sets the charge pump with the value in CPI6-CPI4 for a period of time determined by TC4-TC1. When this time is up, the charge pump current reverts to the value set by CPI3- CPI1. At the same time the CP Gain bit in the A, B Counter latch is reset to 0 and is now ready for the next time the user wishes to change the frequency again. Note that there is an enable feature on the Timer Counter. It is enabled when Fastlock Mode 2 is chosen by setting the Fastlock Mode bit (DB10) in the Function Latch to "1."
Charge Pump Currents
The on-chip multiplexer is controlled by M3, M2, M1 on the ADF4110 family. Table V shows the truth table.
Fastlock Enable Bit
CPI3, CPI2, CPI1 program Current Setting 1 for the charge pump. CPI6, CPI5, CPI4 program Current Setting 2 for the charge pump. The truth table is given in Table V.
Prescaler Value
DB9 of the Function Latch is the Fastlock Enable Bit. Only when this is "1" is Fastlock enabled.
Fastlock Mode Bit
DB10 of the Function Latch is the Fastlock Enable bit. When Fastlock is enabled, this bit determines which Fastlock Mode is used. If the Fastlock Mode bit is "0" then Fastlock Mode 1 is selected and if the Fastlock Mode bit is "1," then Fastlock Mode 2 is selected.
Fastlock Mode 1
P2 and P1 in the Function Latch set the prescaler values. The prescaler value should be chosen so that the prescaler output frequency is always less than or equal to 200 MHz. Thus, with an RF frequency of 2 GHz, a prescaler value of 16/17 is valid but a value of 8/9 is not.
PD Polarity
This bit sets the Phase Detector Polarity Bit. See Table V.
CP Three-State
The charge pump current is switched to the contents of Current Setting 2. The device enters Fastlock by having a "1" written to the CP Gain bit in the AB counter latch. The device exits Fastlock by having a "0" written to the CP Gain bit in the AB counter latch. REV. A
This bit controls the CP output pin. With the bit set high, the CP output is put into three-state. With the bit set low, the CP output is enabled.
-17-
ADF4110/ADF4111/ADF4112/ADF4113
THE INITIALIZATION LATCH
When C2, C1 = 1, 1, the Initialization Latch is programmed. This is essentially the same as the Function Latch (programmed when C2, C1 = 1, 0). However, when the Initialization Latch is programmed an additional internal reset pulse is applied to the R and AB counters. This pulse ensures that the AB counter is at load point when the AB counter data is latched and the device will begin counting in close phase alignment. If the Latch is programmed for synchronous power-down (CE pin is High; PD1 bit is High; PD2 bit is Low), the internal pulse also triggers this power-down. The prescaler reference and the oscillator input buffer are unaffected by the internal reset pulse and so close phase alignment is maintained when counting resumes. When the first AB counter data is latched after initialization, the internal reset pulse is again activated. However, successive AB counter loads after this will not trigger the internal reset pulse.
DEVICE PROGRAMMING AFTER INITIAL POWER-UP
CE can be used to power the device up and down in order to check for channel activity. The input register does not need to be reprogrammed each time the device is disabled and enabled as long as it has been programmed at least once after VDD was initially applied.
The Counter Reset Method
Apply VDD. Do a Function Latch Load ("10" in 2 LSBs). As part of this, load "1" to the F1 bit. This enables the counter reset. Do an R Counter Load ("00" in 2 LSBs) Do an AB Counter Load ("01" in 2 LSBs). Do a Function Latch Load ("10" in 2 LSBs). As part of this, load "0" to the F1 bit. This disables the counter reset. This sequence provides the same close alignment as the initialization method. It offers direct control over the internal reset. Note that counter reset holds the counters at load point and threestates the charge pump, but does not trigger synchronous powerdown. The counter reset method requires an extra function latch load compared to the initialization latch method.
RESYNCHRONIZING THE PRESCALER OUTPUT
After initially powering up the device, there are three ways to program the device.
Initialization Latch Method
Apply VDD. Program the Initialization Latch ("11" in 2 LSBs of input word). Make sure that F1 bit is programmed to "0." Then do an R load ("00" in 2 LSBs). Then do an AB load ("01" in 2 LSBs). When the Initialization Latch is loaded, the following occurs: 1. The function latch contents are loaded. 2. An internal pulse resets the R, A, B, and timeout counters to load state conditions and also three-states the charge pump. Note that the prescaler bandgap reference and the oscillator input buffer are unaffected by the internal reset pulse, allowing close phase alignment when counting resumes. 3. Latching the first AB counter data after the initialization word will activate the same internal reset pulse. Successive AB loads will not trigger the internal reset pulse unless there is another initialization.
The CE Pin Method
Table III (the Reference Counter Latch Map) shows two bits, DB22 and DB21 that are labelled DLY and SYNC respectively. These bits affect the operation of the prescaler. With SYNC = "1," the prescaler output is resynchronized with the RF input. This has the effect of reducing jitter due to the prescaler and can lead to an overall improvement in synthesizer phase noise performance. Typically, a 1 dB to 2 dB improvement is seen in the ADF4113. The lower bandwidth devices can show an even greater improvement. For example, the ADF4110 phase noise is typically improved by 3 dB when SYNC is enabled. With DLY = "1," the prescaler output is resynchronized with a delayed version of the RF input. If the SYNC feature is used on the synthesizer, some care must be taken. At some point, (at certain temperatures and output frequencies), the delay through the prescaler will coincide with the active edge on RF input and this will cause the SYNC feature to break down. So, it is important when using the SYNC feature to be aware of this. Adding a delay to the RF signal, by programming DLY = "1," will extend the operating frequency and temperature somewhat. Using the SYNC feature will also increase the value of the AIDD for the device. With a 900 MHz output, the ADF4113 AIDD increases by about 1.3 mA when SYNC is enabled and a further 0.3 mA if DLY is enabled. All the typical performance plots on the data sheet except for TPC 4 apply for DLY and SYNC = "0," i.e., no resynchronization or delay enabled.
Apply VDD. Bring CE low to put the device into power-down. This is an asynchronous power-down in that it happens immediately. Program the Function Latch (10). Program the R Counter Latch (00). Program the AB Counter Latch (01). Bring CE high to take the device out of power-down. The R and AB counters will now resume counting in close alignment. Note that after CE goes high, a duration of 1 s may be required for the prescaler bandgap voltage and oscillator input buffer bias to reach steady state.
-18-
REV. A
ADF4110/ADF4111/ADF4112/ADF4113
APPLICATIONS SECTION Local Oscillator for GSM Base Station Transmitter
The following diagram shows the ADF4111/ADF4112/ADF4113 being used with a VCO to produce the LO for a GSM base station transmitter. The reference input signal is applied to the circuit at FREFIN and, in this case, is terminated in 50 . Typical GSM system would have a 13 MHz TCXO driving the Reference Input without any 50 termination. In order to have a channel spacing of 200 kHz (the GSM standard), the reference input must be divided by 65, using the on-chip reference divider of the ADF4111/ADF4112/ADF4113. The charge pump output of the ADF4111/ADF4112/ADF4113 (Pin 2) drives the loop filter. In calculating the loop filter component values, a number of items need to be considered. In this example, the loop filter was designed so that the overall phase margin for the system would be 45 degrees. Other PLL system specifications are:
KD = 5 mA KV = 12 MHz/V Loop Bandwidth = 20 kHz FREF = 200 kHz N = 4500 Extra Reference Spur Attenuation = 10 dB All of these specifications are needed and used to come up with the loop filter components values shown in Figure 7. The loop filter output drives the VCO, which, in turn, is fed back to the RF input of the PLL synthesizer and also drives the RF Output terminal. A T-circuit configuration provides 50 matching between the VCO output, the RF output and the RFIN terminal of the synthesizer. In a PLL system, it is important to know when the system is in lock. In Figure 7, this is accomplished by using the MUXOUT signal from the synthesizer. The MUXOUT pin can be programmed to monitor various internal signals in the synthesizer. One of these is the LD or lock-detect signal.
VDD
VP 100pF
RFOUT
1000pF 1000pF FREFIN 51 8
7 15 16 AVDD DVDD VP REFIN CP 2 1nF 3.3k 5.6k 8.2nF 620pF C
B VCC VCO190-902T 100pF 18 P
18
18
ADF4111 ADF4112 ADF4113
CE 14 LOCK CLK DETECT DATA MUXOUT LE 100pF 6 RFINA 1 RSET 5 RFINB 51
CPGND AGND DGND
SPI COMPATIBLE SERIAL BUS
4.7k
3
4
9
100pF
DECOUPLING CAPACITORS ON AVDD, DVDD, VP OF THE ADF411X AND ON THE POSITIVE SUPPLY OF THE VCO190-902T HAVE BEEN OMITTED FROM THE DIAGRAM TO AID CLARITY.
Figure 7. Local Oscillator for GSM Base Station
REV. A
-19-
ADF4110/ADF4111/ADF4112/ADF4113
RFOUT 100pF 18
FREFIN
8
CP REFIN RSET
2
LOOP FILTER
100pF INPUT OUTPUT VCO GND
18
18
CE CLK DATA LE 1 RSET 2.7k
ADF4111 ADF4112 ADF4113
14 MUXOUT LOCK DETECT
RFINA 6 RFINB 5
100pF 51 100pF
AD5320 12-BIT V-OUT DAC
POWER SUPPLY CONNECTIONS AND DECOUPLING CAPACITORS ARE OMITTED FOR CLARITY.
SPI COMPATIBLE SERIAL BUS
Figure 8. Driving the RSET Pin with a D/A Converter
USING A D/A CONVERTER TO DRIVE R SET PIN
You can use a D/A converter to drive the RSET pin of the ADF4110 family and thus increase the level of control over the charge pump current ICP. This can be advantageous in wideband applications where the sensitivity of the VCO varies over the tuning range. To compensate for this, the ICP may be varied to maintain good phase margin and ensure loop stability. See Figure 8.
SHUTDOWN CIRCUIT
wide band applications where the local oscillator could have up to an octave tuning range. For example, cable TV tuners have a total range of about 400 MHz. Figure 10 shows an application where the ADF4113 is used to control and program the Micronetics M3500-2235. The loop filter was designed for an RF output of 2900 MHz, a loop bandwidth of 40 kHz, a PFD frequency of 1 MHz, ICP of 10 mA (2.5 mA synthesizer ICP multiplied by the gain factor of 4), VCO KD of 90 MHz/V (sensitivity of the M3500-2235 at an output of 2900 MHz) and a phase margin of 45C. In narrow-band applications, there is generally a small variation in output frequency (generally less than 10%) and also a small variation in VCO sensitivity over the range (typically 10% to 15%). However, in wide band applications both of these parameters have a much greater variation. In Figure 10, for example, we have -25% and +17% variation in the RF output from the nominal 2.9 GHz. The sensitivity of the VCO can vary from 120 MHz/V at 2750 MHz to 75 MHz/V at 3400 MHz (+33%, -17%). Variations in these parameters will change the loop bandwidth. This in turn can affect stability and lock time. By changing the programmable ICP, it is possible to get compensation for these varying loop conditions and ensure that the loop is always operating close to optimal conditions.
The attached circuit in Figure 9 shows how to shut down both the ADF4110 family and the accompanying VCO. The ADG701 switch goes closed circuit when a Logic 1 is applied to the IN input. The low-cost switch is available in both SOT-23 and micro SO packages.
WIDEBAND PLL
Many of the wireless applications for synthesizers and VCOs in PLLs are narrowband in nature. These applications include the various wireless standards like GSM, DSC1800, CDMA or WCDMA. In each of these cases, the total tuning range for the local oscillator is less than 100 MHz. However, there are also
-20-
REV. A
ADF4110/ADF4111/ADF4112/ADF4113
VP
POWER-DOWN CONTROL VDD
S
VDD RFOUT 100pF 18
IN ADG701 D GND
7 15 16 AVDD DVDD VP CE FREFIN 8 REFIN CP RSET
2 1
VCC LOOP FILTER GND VCO
100pF 18
18
ADF4110 ADF4111 ADF4112 ADF4113
RFINA 6 5
4.7k
100pF 51
CPGND
RFINB
AGND
DGND
3
4
9
100pF
DECOUPLING CAPACITORS AND INTERFACE SIGNALS HAVE BEEN OMITTED FROM THE DIAGRAM TO AID CLARITY.
Figure 9. Local Oscillator Shutdown Circuit
20V VDD VP 1k 15 16 7 AVDD DVDD VP 2 CP REFIN RSET 2.8nF 4.7k 3.3k 19nF 680 130pF AD820 3k
RFOUT 12V 100pF VCC V_TUNE OUT 18 100pF 18
18
1000pF 1000pF FREFIN 51 8
M3500-2235 GND
ADF4113
CE CLK DATA LE 14
MUXOUT
LOCK DETECT
SPI-COMPATIBLE SERIAL BUS
RFINA
6 5
100pF 51
CPGND
RFINB
AGND
DGND
3
4
9
100pF
DECOUPLING CAPACITORS ON AVDD, DVDD, VP OF THE ADF4113 AND ON VCC OF THE M3500-2250 HAVE BEEN OMITTED FROM THE DIAGRAM TO AID CLARITY.
Figure 10. Wideband Phase Locked Loop
REV. A
-21-
ADF4110/ADF4111/ADF4112/ADF4113
DIRECT CONVERSION MODULATOR
In some applications a direct conversion architecture can be used in base station transmitters. Figure 11 shows the combination available from ADI to implement this solution. The circuit diagram shows the AD9761 being used with the AD8346. The use of dual integrated DACs such as the AD9761 with specified 0.02 dB and 0.004 dB gain and offset matching characteristics ensures minimum error contribution (over temperature) from this portion of the signal chain. The Local Oscillator (LO) is implemented using the ADF4113. In this case, the OSC 3B1-13M0 provides the stable 13 MHz reference frequency. The system is designed for a 200 kHz channel spacing and an output center frequency of 1960 MHz.
The target application is a WCDMA base station transmitter. Typical phase noise performance from this LO is -85 dBc/Hz at a 1 kHz offset. The LO port of the AD8346 is driven in single-ended fashion. LOIN is ac-coupled to ground with the 100 pF capacitor and LOIP is driven through the ac coupling capacitor from a 50 source. An LO drive level of between -6 dBm and -12 dBm is required. The circuit of Figure 11 gives a typical level of -8 dBm. The RF output is designed to drive a 50 load but must be ac-coupled as shown in Figure 11. If the I and Q inputs are driven in quadrature by 2 V p-p signals, the resulting output power will be around -10 dBm.
REFIO
IOUTA IOUTB
LOW-PASS FILTER
IBBP IBBN VOUT
100pF RFOUT
MODULATED DIGITAL DATA
AD9761 TxDAC
QOUTA FS ADJ 2k 4.7k QOUTB LOW-PASS FILTER QBBP QBBN
AD8346
LOIN 100pF
LOIP 100pF
OSC 3B1-13M0 RSET TCXO REFIN CP 910pF 3.9k 620pF 9.1nF RFINB 100pF RFINA 100pF 51 VCO190-1960T 3.3k 100pF 18
18
SERIAL DIGITAL NTERFACE
ADF4113
18
POWER SUPPLY CONNECTIONS AND DECOUPLING CAPACITORS ARE OMITTED FROM DIAGRAM FOR CLARITY.
Figure 11. Direct Conversion Transmitter Solution
-22-
REV. A
ADF4110/ADF4111/ADF4112/ADF4113
INTERFACING ADSP-2181 Interface
The ADF4110 family has a simple SPI-compatible serial interface for writing to the device. SCLK, SDATA and LE control the data transfer. When LE (Latch Enable) goes high, the 24 bits which have been clocked into the input register on each rising edge of SCLK will get transferred to the appropriate latch. See Figure 1 for the Timing Diagram and Table I for the Latch Truth Table. The maximum allowable serial clock rate is 20 MHz. This means that the maximum update rate possible for the device is 833 kHz or one update every 1.2 microseconds. This is certainly more than adequate for systems that will have typical lock times in hundreds of microseconds.
ADuC812 Interface
Figure 13 shows the interface between the ADF4110 family and the ADSP-21xx Digital Signal Processor. The ADF4110 family needs a 24-bit serial word for each latch write. The easiest way to accomplish this using the ADSP-21xx family is to use the Autobuffered Transmit Mode of operation with Alternate Framing. This provides a means for transmitting an entire block of serial data before an interrupt is generated.
SCLK SCLK SDATA LE CE
ADSP-21xx
DT TFS
ADF4110 ADF4111 ADF4112 ADF4113
Figure 12 shows the interface between the ADF4110 family and the ADuC812 microconverter. Since the ADuC812 is based on an 8051 core, this interface can be used with any 8051-based microcontroller. The microconverter is set up for SPI Master Mode with CPHA = 0. To initiate the operation, the I/O port driving LE is brought low. Each latch of the ADF4110 family needs a 24-bit word. This is accomplished by writing three 8-bit bytes from the microconverter to the device. When the third byte has been written the LE input should be brought high to complete the transfer. On first applying power to the ADF4110 family, it needs three writes (one each to the R counter latch, the N counter latch and the initialization latch) for the output to become active. I/O port lines on the ADuC812 are also used to control powerdown (CE input) and to detect lock (MUXOUT configured as lock detect and polled by the port input). When operating in the mode described, the maximum SCLOCK rate of the ADuC812 is 4 MHz. This means that the maximum rate at which the output frequency can be changed will be 166 kHz.
SCLOCK SCLK SDATA LE I/O PORTS CE
I/O FLAGS
MUXOUT (LOCK DETECT)
Figure 13. ADSP-21xx to ADF4110 Family Interface
Set up the word length for 8 bits and use three memory locations for each 24-bit word. To program each 24-bit latch, store the three 8-bit bytes, enable the Autobuffered mode and then write to the transmit register of the DSP. This last operation initiates the autobuffer transfer.
PCB DESIGN GUIDELINES FOR CHIP SCALE PACKAGE
The lands on the chip scale package (CP-20), are rectangular. The printed circuit board pad for these should be 0.1 mm longer than the package land length and 0.05 mm wider than the package land width. The land should be centered on the pad. This will ensure that the solder joint size is maximized. The bottom of the chip scale package has a central thermal pad. The thermal pad on the printed circuit board should be at least as large as this exposed pad. On the printed circuit board, there should be a clearance of at least 0.25 mm between the thermal pad and the inner edges of the pad pattern. This will ensure that shorting is avoided. Thermal vias may be used on the printed circuit board thermal pad to improve thermal performance of the package. If vias are used, they should be incorporated in the thermal pad at 1.2 mm pitch grid. The via diameter should be between 0.3 mm and 0.33 mm and the via barrel should be plated with 1 oz. copper to plug the via. The user should connect the printed circuit board thermal pad to AGND.
ADuC812
MOSI
ADF4110 ADF4111 ADF4112 ADF4113
MUXOUT (LOCK DETECT)
Figure 12. ADuC812 to ADF4110 Family Interface
REV. A
-23-
ADF4110/ADF4111/ADF4112/ADF4113
OUTLINE DIMENSIONS
Dimensions shown in inches and (mm).
Chip Scale (CP-20)
C00391a-3-1/01 (rev. A)
0.024 (0.60) 0.017 (0.42) 0.009 (0.24) 0.024 (0.60) 0.017 (0.42) 16 0.009 (0.24) 15 0.148 (3.75) BSC SQ 0.030 (0.75) 0.022 (0.55) 0.014 (0.35)
BOTTOM VIEW
11 10 6 5
0.157 (4.0) BSC SQ
20 1
PIN 1 INDICATOR
TOP VIEW
0.096 (2.45) 0.091 (2.30) SQ 0.085 (2.15)
12 MAX 0.039 (1.00) MAX 0.033 (0.85) NOM
0.031 (0.80) MAX 0.026 (0.65) NOM
0.020 (0.50) 0.008 (0.20) REF BSC CONTROLLING DIMENSIONS ARE IN MILLIMETERS
0.002 (0.05) 0.0004 (0.01) 0.0 (0.0)
0.012 (0.30) 0.009 (0.23) 0.007 (0.18)
Thin Shrink Small Outline (RU-16)
0.201 (5.10) 0.193 (4.90)
16
9
0.177 (4.50) 0.169 (4.30) 0.256 (6.50) 0.246 (6.25)
1 8
PIN 1 0.006 (0.15) 0.002 (0.05) 0.0433 (1.10) MAX
SEATING PLANE
0.0256 (0.65) BSC
0.0118 (0.30) 0.0075 (0.19)
0.0079 (0.20) 0.0035 (0.090)
8 0
0.028 (0.70) 0.020 (0.50)
ADF4110/ADF4111/ADF4112/ADF4113-Revision History
Location Page Changed Data Sheet from REV. 0 to REV. A. Changes to DC Specifications in B Version, B Chips, Unit and Test Conditions/Comments columns . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Changes to Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Change to RFINA Function text . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Changes to Figure 8 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 New graph added--TPC 22 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Change to PD Polarity Box in Table V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Change to PD Polarity Box in Table VI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Change to PD Polarity paragraph . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Addition of new material (PCB Design Guidelines for Chip-Scale Package) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Replacement of CP-20 Outline with CP-20 [2] outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
PRINTED IN U.S.A.
-24-
REV. A

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